High-frequency device including high-frequency switching circuit

ABSTRACT

A high-frequency device having a switching circuit including a semiconductor substrate; a first high-frequency input/output terminal; a second high-frequency input/output terminal; a control signal input terminal; a power terminal; a ground terminal; an insulating portion disposed on a main surface of the semiconductor substrate; and a voltage-applying electrode for applying a predetermined positive voltage from the power electrode to the semiconductor substrate, wherein the switching circuit includes a field-effect transistor disposed in an active region of the semiconductor substrate.

CROSS REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/029,996 filed Sep. 18, 2013, which is a continuation of U.S. patentapplication Ser. No. 11/458,521 filed Jul. 19, 2006, now U.S. Pat. No.8,598,629 issued on Dec. 3, 2013, the entireties of which areincorporated herein by reference to the extent permitted by law. Thepresent invention contains subject matter related to Japanese PatentApplication JP 2005-210169 filed in the Japanese Patent Office on Jul.20, 2005, the entire contents of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to high-frequency devices includinghigh-frequency switching circuits and being applicable to, for example,cellular phones.

2. Description of the Related Art

For example, cellular phones have communicated with each other usinghigh-frequency signals having frequencies in the range of 800 MHz to 2.3GHz. In such relatively high frequencies, compound semiconductors suchas GaAs, which has high electron mobility, in place of known Group IVsemiconductors, such as a Si semiconductor, have often been used forpower amplifiers (PAs) for amplifying transmission powers, low-noiseamplifiers (LNA) for amplifying received signals, and switching circuitsfor switching signals, in view of high-frequency characteristics.

Devices including high-frequency integrated circuits containing thecompound semiconductors such as GaAs have satisfactory high-frequencycharacteristics when the devices are driven at low voltages. However, astrends toward lower voltage and higher performance grow, there have beenfurther stringent demands for the improvement of frequencycharacteristics, in particular, a reduction in distortion of switchingcircuits that correspond to third-generation (3G) cellular phones andthat enable simultaneous transmission and reception.

For example, as switching circuits for switching antennae in cellularphones, from the above-described reasons, switch monolithic microwaveintegrated circuits (switch MMICs) including field-effect transistors(FETs) each containing a GaAs compound semiconductor have often beenused. Such antenna-switching circuits are required to meet stringentrequirements: low loss, low distortion, and the like at a low operatingvoltage, e.g., at an operating voltage of 2.6 V.

Various switch ICs have been proposed (for example, see Uda. A Very HighIsolation GaAs SPDT Switch IC Seald in an Ultra-compact Plastic Package.IEEE GaAs IC Symposium 1995, pp. 132-135H).

FIG. 12 is a circuit diagram showing the most basic switching circuitincluding junction gate field-effect transistors (J-FETs) eachcontaining, for example, a GaAs compound semiconductor. In this case, afirst FET1 and a second FET2 are disposed on a common GaAs substrate,the first FET1 and the second FET2 each being a J-FET. The source of thefirst FET1 is connected to the drain of the second FET2. One end of thecurrent channel of the first FET1 is connected to a first input/outputterminal I/O1 with a capacitor C1, the other end is connected to asecond input/output terminal I/O2 via a capacitor C2. One end of thecurrent channel of the second FET2 is connected to a ground terminal GNDvia a capacitor C3. Thereby, the circuit is DC-decoupled from theexterior.

The gate of the first FET1 is connected to a control signal inputterminal CTL1 via a resistor R1. The gate of the second FET2 isconnected to a control signal input terminal CTL2 via a resistor R2. Themidpoint of the current channel between the source of the first FET1 andthe drain of the second FET2 is connected to a DC bias terminal via aresistor R3.

In this switching circuit 11, for example, a logic circuit applies abias voltage of 2 V to the switching circuit via the resistor R3. Forexample, when a high voltage, e.g., 3 V, is applied to the terminalCTL1, the gate bias (with respect to the drain and source) of the firstFET1 is 1 V. As a result, the FET1 is ON. On the other hand, forexample, when a low voltage, e.g., 0 V, is applied to the terminal CTL2,the gate bias (with respect to the drain and source) of the second FET2is −2 V. As a result, the FET2 is OFF. Therefore, the channel betweenthe terminals I/O1 and I/O2 is ON, that is, the switching circuit is ON.

In contrast, for example, when a low voltage, e.g., 0 V, is applied tothe terminal CTL1, the gate bias (with respect to the drain and source)of the first FET1 is −2 V. As a result, the FET1 is OFF. On the otherhand, for example, when a high voltage, e.g., 3 V, is applied to theterminal CTL2, the gate bias (with respect to the drain and source) ofthe second FET2 is 1 V. As a result, the FET2 is ON. Therefore, thechannel between the terminals I/O1 and I/O2 is OPEN. That is, the signalchannel is high-frequency-short-circuited, thus ensuring furtherisolation.

FIG. 13 is a schematic cross-sectional view of a mounted high-frequencydevice including a known switch MMIC having the above-describedswitching circuit.

In this case, a switch MMIC 102 is mounted on a conductive die pad 101.Electrodes of the MMIC 102 are connected to first and secondhigh-frequency input/output terminals I/O1 and I/O2, at which a highfrequency is inputted or outputted, with lead wires 104 or the like. Theswitch MMIC 102, the conductive die pad 101, and the first and secondhigh-frequency input/output terminals I/O1 and I/O2 are covered with aresin mold 105 to form a packaged integrated circuit (IC). The packagedIC is disposed on a circuit board 100. The conductive die pad 101 andthe first and second high-frequency input/output terminals I/O1 and I/O2are electrically connected to the circuit board 100.

The die pad 101 is formed of a conductive metal layer and is grounded.

FIG. 14 is a schematic fragmentary cross-sectional view of a junctiongate field-effect transistor (J-FET) containing, for example, GaAs. Inthis case, a lightly doped semiconductor layer constituting achannel-forming region 107 is disposed on a GaAs substrate 106 composedof bulk GaAs and is disposed between, for example, two heavily doped Nregions, i.e., a source region 108S and a drain region 108D. A drainelectrode D, a source electrode S, and a gate electrode G are in ohmiccontact with the drain region, the source region, and the gate region,respectively.

The presence of the semiinsulating GaAs substrate 106 disposed directlybelow the channel-forming region 107, i.e., remote from a gate region109, minimizes leakage of a signal.

SUMMARY OF THE INVENTION

As described above, in consumer applications typified by cellularphones, high-frequency MMICs each containing a GaAs compoundsemiconductor have often been used. Achievement of high-frequency GaAsICs having satisfactory high-frequency performance and productivity isrequired.

However, in the high-frequency switching circuits each containing thecompound semiconductor, it is difficult to sufficiently achieve lowerdistortion, which is a stringent requirement, with high reliability.

According to an embodiment of the present invention, there is provided ahigh-frequency device including a high-frequency switching circuit thatovercomes such disadvantages.

According to an embodiment of the present invention, there is provided ahigh-frequency device including a switching circuit that overcomes suchdisadvantages.

A high-frequency device having a switching circuit according to anembodiment of the present invention includes a compound semiconductorsubstrate; a first high-frequency input/output terminal; a secondhigh-frequency input/output terminal; a control signal input terminal; apower terminal; a ground terminal; an insulating portion disposed on onemain surface of the compound semiconductor substrate; and avoltage-applying electrode for applying a predetermined positive voltagefrom the power electrode to the compound semiconductor substrate,wherein the switching circuit having a field-effect transistor disposedon the other main surface of the active region of the compoundsemiconductor substrate.

In the above-described high-frequency device having the switchingcircuit according to an embodiment of the present invention, thepositive voltage applied to the compound semiconductor substrate is afixed positive voltage.

In the above-described device according to an embodiment of the presentinvention, the insulating portion is disposed on the back surface of thecompound semiconductor substrate constituting the switching circuit.Thus, the positive voltage is applied to the compound semiconductorsubstrate while the substrate is electrically isolated from othercomponents. Therefore, it is possible to stably suppress and control adepletion region under the field-effect transistor.

The above-described high-frequency device having the switching circuitaccording to an embodiment of the present invention further includes aresistor for applying the predetermined positive voltage to the compoundsemiconductor substrate, the resistor being disposed between the powerterminal and the voltage-applying terminal.

The above-described high-frequency device having the switching circuitaccording to an embodiment of the present invention further includes ametal plate disposed between the compound semiconductor substrate andthe insulating portion, the metal plate being attached to the compoundsemiconductor substrate, wherein the metal plate serves as thevoltage-applying electrode.

The high-frequency device having the switching circuit according to anembodiment of the present invention further includes a siliconsemiconductor substrate having a complementary metal-oxide semiconductorlogic circuit; a control signal input terminal for feeding a controlsignal to the logic circuit; and a control signal output terminal forreceiving a control signal from the logic circuit.

In the high-frequency device having the switching circuit according toan embodiment of the present invention, the compound semiconductorsubstrate is a GaAs substrate.

In the above-described structure according to an embodiment of thepresent invention, the insulating portion is disposed on the backsurface of the compound semiconductor substrate, and a positive voltageis applied to the substrate. Thus, it is possible to compensate thenonuniformity of control in a production process and to significantlyreduce distortion, as compared with a known unstable switching circuitto which a positive voltage is not applied.

This is believed to be due to the following.

With respect to a reduction in the distortion of a switching circuitcomposed of a compound semiconductor, in a current technique ofproducing a compound semiconductor, for example, a low-level impurityconcentration and a material composition profile are not sufficientlycontrolled. Thus, the production of the field-effect transistor resultsin a minute lot-to-lot variation. In an unstable state in which avoltage is not applied to the compound semiconductor substrate, in fact,in the unstable state in which a bias voltage such as a ground voltageis not applied to the compound semiconductor substrate, an undesiredtrap is left directly below a channel, and a depletion region isdifficult to be controlled. This is believed to be the cause for thegeneration of the distortion.

Furthermore, a large time constant of the capture or release of anelectric charge by the trap impairs the high-speed control of ahigh-frequency circuit.

Moreover, the depletion region is an undesired capacitance component todegrade high-frequency characteristics.

According to an embodiment of the present invention, the substrate iselectrically isolated by the insulating portion, and a voltage isapplied to the substrate. As a result, the influence of the trap and thedepletion region are suppressed, thus reducing the distortion andimproving the high-frequency characteristics.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a device according to an embodiment of thepresent invention;

FIG. 2 is a schematic fragmentary cross-sectional view of a deviceaccording to an embodiment of the present invention;

FIG. 3 is a schematic fragmentary cross-sectional view of a deviceaccording to another embodiment of the present invention;

FIG. 4 is a schematic fragmentary cross-sectional view of a deviceaccording to another embodiment of the present invention;

FIG. 5 is a schematic fragmentary cross-sectional view of a deviceaccording to another embodiment of the present invention;

FIG. 6 is a schematic fragmentary cross-sectional view of a deviceaccording to another embodiment of the present invention;

FIG. 7 is a schematic fragmentary cross-sectional view of a deviceaccording to another embodiment of the present invention;

FIG. 8 is a schematic plan view of a device according to anotherembodiment of the present invention;

FIG. 9 is a graph showing the dependence of the OFF capacitance of afield-effect transistor on voltage applied to a substrate of a deviceaccording to an embodiment of the present invention;

FIG. 10 is an illustration of a distortion measurement on a known deviceand a device according to an embodiment of the present invention;

FIG. 11 is a table showing distortion measurement results of the knowndevice and the device according to the embodiment of the presentinvention;

FIG. 12 is a circuit diagram of a high-frequency switching circuit;

FIG. 13 is a schematic cross-sectional view of a known switch MMIC; and

FIG. 14 is a schematic cross-sectional view of a field-effect transistorconstituting a known switching circuit.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A high-frequency device including a switching circuit according to anembodiment of the present invention will be exemplified. It isunderstood that the present invention is not limited to the embodiment.

FIG. 1 is a block diagram of a device according to the embodiment of thepresent invention. FIG. 2 is a schematic fragmentary cross-sectionalview of the device.

In the present invention, a switching circuit 11 including a FET1 thatis a high-electron-mobility transistor (HEMT), a junction field-effecttransistor, or the like is disposed on a compound semiconductorsubstrate 1 composed of GaAs or the like. In this embodiment, theswitching circuit 11 and a logic circuit 12 for controlling theswitching circuit 11.

An insulating portion 2 is disposed on the back surface of the GaAscompound semiconductor substrate 1, i.e., the insulating portion 2 isdisposed on a main surface opposite a main surface at which thefield-effect transistor is disposed. In this embodiment, the insulatingportion 2 is an insulating package substrate 20 composed of, forexample, a glass epoxy resin of flame retardant type 4 (FRT4).

The package substrate 20 includes, for example, first and secondinput/output terminals I/O1 and I/O2 and a ground terminal GND, whichare used for the switching circuit 11; and control signal inputterminals CTL1 and CTL2 and a power terminal Vdd, which are used for thelogic circuit 12.

The compound semiconductor substrate 1 includes, for example, ahigh-frequency device containing the switching circuit 11 having thesame circuit structure as that shown in FIG. 12 and the logic circuit 12for driving the switching circuit 11.

In the present invention, the compound semiconductor substrate 1includes a voltage-applying electrode 30 for applying a predeterminedpositive voltage to the compound semiconductor substrate 1. Apredetermined positive voltage from the power terminal Vdd is applied tothe voltage-applying electrode 30. In this case, preferably, a resistorR is disposed between the power terminal Vdd and the voltage-applyingelectrode 30 to intercept an alternating current component when thevoltage is applied to the voltage-applying electrode 30.

For example, a power supply connection terminal 33 is disposed on aninsulating surface layer 34 on the compound semiconductor substrate 1.The power supply connection terminal 33 is connected to the powerterminal Vdd with a lead wire or the like. The resistor R is formed as acircuit element in the compound semiconductor substrate 1 and isdisposed between the power supply connection terminal 33 and thevoltage-applying electrode 30.

As described above, the switching circuit 11 includes first and secondFET1 and FET2 on the common compound semiconductor substrate 1, forexample, a GaAs substrate, the FET1 and FET2 each being a HEMT or aJ-FET. The source of the first FET1 is connected to the drain of thesecond FET2. One end of the current channel of the first FET1 isconnected to a first input/output terminal I/O1 with a capacitor C1, theother end is connected to a second input/output terminal I/O2 via acapacitor C2. One end of the current channel of the second FET2 isconnected to a ground terminal GND via a capacitor C3. Thereby, thecircuit is DC-decoupled from the exterior.

Gates of the first and second FET1 and FET2 are connected to controlsignal input terminals CTL1 and CTL2 via resistor R1 and R2,respectively, the signal input terminals CTL1 and CTL2 receiving controlsignals from the logic circuit 12. The midpoint of the current channelbetween the source of the first FET1 and the drain of the second FET2 isconnected to a DC bias terminal via a resistor R3.

The logic circuit 12 is supplied with a voltage from the power terminalVdd to which a power supply voltage is applied. Control signals fromcontrol signal terminals CTLa and CTLb are fed to the logic circuit 12.The logic circuit 12 feeds predetermined control signals to the controlsignal input terminals CTL1 and CTL2. The logic circuit 12 feeds apredetermined bias voltage to a bias terminal Bias.

The above-described circuit elements, i.e., the switching circuit 11 andthe logic circuit 12, are disposed on a main surface of the activeregion 1 a of the compound semiconductor substrate 1. The active region1 a can be formed by ion implantation.

The first field-effect transistor FET1 is exemplified in FIG. 2. Thefield-effect transistor is formed by the following procedure: forexample, a p-type gate region 5 or the like is formed on achannel-forming region 4 having low impurity concentration by ionimplantation or the like. An n-type source or drain 3 is similarlyformed by ion implantation or the like so as to be disposed at each sideof the channel-forming region 4.

A resin mold package 40 covers the compound semiconductor substrate 1and the like disposed on the package substrate 20.

The switching circuit 11 having the structure is controlled by a signalfrom the logic circuit 12 and operates in the same way as described inFIG. 12.

That is, for example, a bias voltage of 2 V from the logic circuit 12 isapplied to the switching circuit 11 via the resistor R3. For example,when a high voltage, e.g., 3 V, is applied to the terminal CTL1, thegate bias (with respect to the drain and source) of the first FET1 is 1V. As a result, the FET1 is ON. On the other hand, for example, when alow voltage, e.g., 0 V, is applied to the terminal CTL2, the gate bias(with respect to the drain and source) of the second FET2 is −2 V. As aresult, the FET2 is OFF. Therefore, the channel between the terminalsI/O1 and I/O2 is ON, that is, the switching circuit 11 is ON.

In contrast, for example, when a low voltage, e.g., 0 V, is applied tothe terminal CTL1, the gate bias (with respect to the drain and source)of the first FET1 is −2 V. As a result, the FET1 is OFF. On the otherhand, for example, when a high voltage, e.g., 3 V, is applied to theterminal CTL2, the gate bias (with respect to the drain and source) ofthe second FET2 is 1 V. As a result, the FET2 is ON. Therefore, thechannel between the terminals I/O1 and I/O2 is OPEN. That is, the signalchannel is high-frequency-short-circuited, thus ensuring furtherisolation.

In the present invention, as described above, the voltage-applyingelectrode 30 is disposed on the compound semiconductor substrate 1 inorder to apply, for example, a predetermined positive bias voltage tothe compound semiconductor substrate 1. This results in a high-frequencydevice including a switching circuit having improved distortion.

This is believed to result from a decrease in capacitance due to thereduction of the depletion region of the field-effect transistor. Forexample, this is believed to result from the prevention of the captureand release of an unstable electric charge by a trap or the like.

In the embodiment shown in FIG. 2, the voltage-applying electrode 30 isdisposed on a main surface having the circuit elements, such as a FET,of the compound semiconductor substrate 1. Alternatively, as shown inFIG. 3 that is a schematic fragmentary cross-sectional view of ahigh-frequency device including a switching circuit according to anembodiment of the present invention, the voltage-applying electrode 30may be constituted of first and second electrodes 31 and 32 that areelectrically connected to each other.

In this case, a resistor R may be disposed between the first and secondelectrodes 31 and 32. Alternatively, the above-described resistor R maybe disposed between the first electrode 31 and the power supplyconnection terminal 33.

As shown in FIG. 3, the first electrode 31 is disposed on one mainsurface having circuit elements, such as a FET, of the compoundsemiconductor substrate 1. The second electrode 32 is disposed on theother main surface. A positive voltage can be applied to the compoundsemiconductor substrate 1 using the second electrode 32.

As shown in FIG. 3, the first electrode 31 may be electrically connectedto the second electrodes 32 through a via hole 50 passing through thecompound semiconductor substrate 1.

Alternatively, the first electrode 31 may be electrically connected tothe second electrodes 32 with lead wires.

In the structure shown in FIG. 3, the second electrode 32 is disposedunder at least a region at which field-effect transistors, such as FET1and FET2, are disposed. However, a larger area of the second electrode32 results in larger parasitic capacitance, thereby possibly affectinghigh-frequency characteristics. Thus, the area of the second electrode32 is preferably 50% or less of that of the compound semiconductorsubstrate 1.

FIG. 4 is a schematic cross-sectional view of a device according toanother embodiment of the present invention. In this embodiment, a metalplate is disposed between the compound semiconductor substrate and theinsulating portion 2.

In this embodiment, a metal plate 60, which is a lead frame, isdisposed. A die pad 61 of the lead frame is electrically connected tothe back surface of the compound semiconductor substrate 1 shown in FIG.2 with a conductive material 62, such as a silver paste. The resin moldpackage 40 functions as the insulating portion 2. In this case, thevoltage-applying electrode 30 may be connected to the power terminal Vddvia the die pad 61 and the above-described resistor R.

In FIGS. 3 and 4, the same or equivalent elements corresponding to FIGS.1 and 2 are designated using the same reference numerals, and redundantdescription is not repeated.

FIGS. 5, 6, and 7 are each a schematic cross-sectional view showing anexemplary positional relationship between a field-effect transistor(FET) and the voltage-applying electrode 30. Each exemplified FET is ajunction-gate pseudomorphic high-electron-mobility transistor (PHEMT).That is, the compound semiconductor substrate 1 provided withepitaxially grown semiconductor layers constituting the PHEMT isdisposed on a semi-insulating (SI) GaAs substrate 1S or the like.

As shown in each of FIGS. 5, 6, and 7, for example, an undoped bufferlayer 71 composed of AlGaAs, a first n-type-impurity-doped layer 72, achannel layer 73, a second n-type-impurity-doped layer 74, and a lightlydoped layer 75 are formed in that order by epitaxial growth on the GaAssubstrate 1S. A p-type gate region 76 is formed by ion implantation ofZn ions or the like.

Contact layers 78, which are each an n-type heavily doped source/draincomposed of GaAs or the like, are disposed between the p-type gateregion 76. Electrodes 79 are disposed on the respective contact layers78. Thereby, the FET, which is HEMT, is formed.

In addition to the active region 1 a including the circuit elements suchas the FET, a high-resistivity nonactive region 1 b formed by ionimplantation of boron B is disposed so as to surround the active region1 a or to separate a plurality of active regions.

As shown in FIG. 5 or 7, the voltage-applying electrode 30 may bedisposed on the nonactive region 1 b. Alternatively, as shown in FIG. 6,which is a schematic cross-sectional view, the voltage-applyingelectrode 30 may be disposed on another active region 1 a separated fromthe active region 1 a including the FET by the nonactive region 1 b.

The voltage-applying electrode 30 is in contact with an impurity-dopedregion 77 of the same conductivity type as that of the channel(channel-forming region) or the same conductivity type as that of thegate.

In this structure, it was confirmed that distortion characteristics andisolation were further stabilized and improved. This is believed toresult from the successful application of a positive voltage to the backside of the FET.

The impurity-doped region 77 can be formed simultaneously with, forexample, the formation of the p-type gate region 76 of the FET, such asthe HEMT, or the contact layers 78, which are each a source/drain.

In the above-described embodiment, the nonactive region 1 b is formed byion implantation. Alternatively, the active region 1 a may be formed ina high-resistivity semiconductor layer by ion implantation depending onthe structure of the FET.

In each of the above-described embodiments, the switching circuit 11 andthe logic circuit 12 are disposed on the common compound semiconductorsubstrate 1. Alternatively, as shown in FIG. 8, which is a schematicplan view, a high-frequency device having the following structure may beformed: for example, only the switching circuit 11 is disposed on theGaAs compound semiconductor substrate 1. A logic circuit is disposed on,for example, a Si substrate, which is a Group IV element semiconductorsubstrate, different from the compound semiconductor substrate 1. Theswitching circuit 11 is connected to the logic circuit with lead wiresor the like. In FIG. 8, the same or equivalent elements are designatedusing the same reference numerals, and redundant description is notrepeated.

FIG. 9 is a graph showing the dependence of the OFF capacitance of thefield-effect transistor FET1 on bias voltage applied to the compoundsemiconductor substrate 1. In this case, it is found that the OFFcapacitance is reduced by 10% when a voltage of 3 V is applied to thesubstrate.

That is, with respect to switching properties, isolation is improved.

The device shown in FIG. 3 is a high-frequency device having a dual poledual throw (DPDT) switch. In this case, intermodulation distortions IMD2and IMD3 are significantly improved.

As shown in FIG. 10, high-frequency input signals RF2 and RF1 are fed toa dual pole 3 throw (DP3T) switching circuit between input/outputterminals I/O1 and I/O2. FIG. 11 shows second- and third-orderintermodulation distortions in an inventive example, in which a voltageis applied to a substrate, and a related example, in which a voltage isnot applied to a substrate. As is clear from the results, in theinventive example, the intermodulation distortions are improved.

As described above, a high-frequency device, corresponding to 3G,according to the embodiment of the present invention meets the stringentrequirements, i.e., has improved high-frequency characteristics, inparticular, reduced distortion.

The present invention is not limited to the above-described embodiments.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A high-frequency device having a switchingcircuit, the device comprising: an insulating substrate; a semiconductorsubstrate on the insulating substrate; an active region on a firstsurface of the semiconductor substrate, the first surface facing awayfrom the insulating substrate; a switching circuit within the activeregion; an electrode on the semiconductor substrate; and a resistor inthe semiconductor substrate, wherein, the electrode is in direct contactwith the semiconductor substrate such that a voltage signal can beapplied to the semiconductor substrate via the electrode, and theswitching circuit includes a field-effect transistor.
 2. The device ofclaim 1, wherein the semiconductor substrate includes a non-activeregion formed by ion implantation.
 3. The device of claim 1, wherein thesemiconductor substrate includes a non-active region formed by etching.7. The device of claim 1, wherein the semiconductor substrate includes anon-active region and the electrode is located within the non-activeregion.
 8. The device of claim 1, wherein the semiconductor substrateincludes: a non-active region; and an impurity-doped region in thenon-active region, the impurity-doped region having a conductivity typethe same as that of a channel of the field-effect transistor wherein,the electrode is in contact with the impurity-doped region.
 9. Thedevice of claim 1, further comprising a metal plate located between thesemiconductor substrate and the insulating substrate, the metal platebeing attached to the compound semiconductor substrate, and the metalplate being the electrode.
 10. The device of claim 1, wherein thesemiconductor substrate is a GaAs substrate.
 11. A device comprising: aninsulating substrate; a semiconductor substrate on the insulatingsubstrate, the semiconductor substrate having an active region; anelectrode on the semiconductor substrate; a resistor in thesemiconductor substrate and electrically coupled to the electrode; and aswitching circuit located on a first surface of the semiconductorsubstrate, the first surface facing away from the insulating substrate,wherein, the electrode is in direct contact with the semiconductorsubstrate such that a voltage signal can be applied to the semiconductorsubstrate via electrode, the switching circuit includes a field-effecttransistor located within the active region, and the semiconductorsubstrate is electrically isolated by the insulating substrate.